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Title
A Dutch manufacturer of precision parts for the semiconductor industry is looking for planarization, chemical mechanical polishing or lapping partner
Reference
TRNL20200709001
Last update
Tue, Jul, 14, 2020
Deadline
Wed, Jul, 14, 2021
Abstract
A Dutch SME develops, manufactures and supplies micro-precision parts to suit the semiconductor industry. The Dutch SME looks for partner that offers a planarization, chemical mechanical polishing, fly cutting or lapping technology. Most important requirement is downsizing the non-planarity or thickness variation to about 1 micron. The Dutch SME looks for a technical cooperation agreement with a partner offering equipment and expertise to downsize non-planarity.
Description
A Dutch SME develops, manufactures and supplies micro-precision parts for different industrial sectors. The Dutch SME is a world leader in customized precision metal parts manufacturing thanks to the equipment and many years of experience in combining electroforming, photo-etching, and laser cutting technologies.
Typical precision products are parts with micro holes, high precision metal parts and precision optical parts.
Most important services of the Dutch SME are:
- Micro-precision parts manufacturing
- Co-development
- Metal finishing
- Forming and assembly services.
For the semiconductor industry the Dutch SME is producing rigid substrates. For these rigid substrates the Dutch SME looks for partners that can offer planarization, chemical mechanical polishing, fly cutting or lapping expertise and technologies.
The planarization process step is needed to remove topography from in this case a metal surface. The planarization technology is used to prepare metal layers for following lithographic step, avoiding depth focus problems during illumination of photosensitive layers.
The Dutch SME looks for expertise and equipment to downsize non-planarity of the rigid substrate that is made of the material brass. The Dutch SME has 4 different types of substrate samples for initial planarization tests. The dimensions of the substrate are 352*320*0,80 millimeter. The brass substrate contains coatings which are actually the items to be planarized. The used coating materials are Nickel, Copper and Gold. The coating materials are used in different layer combinations and thicknesses of layers.
For the different coating combinations different planarizing requirements are set but the general idea is to downsize non-planarity of the coating to about 1 micron.
The Dutch SME looks for a technical cooperation agreement with the planarization partner. The role of the desired partner is bringing in the equipment and expertise for planarization.
It is the idea that after successful demonstration of the feasibility the planarization step will be outsourced to the partner.
Technology Keywords
Micro and Nanotechnology related to Electronics and Microelectronics;Machining, fine (grinding, lapping);Surface treatment (painting, galvano, polishing, CVD, ..);Micromachining, nanomachining
Keyword Codes:
01002001;02002011;02002015;02002017
Current Stage of Development
Intellectual Property Rights
Other
IPR Comments:
Exploitation of RTD Results
Organisation/Company Type
Organisation/Company Size
Organisation Comments
Expertise and equipment for the planarization of metal substrates with a tolerance of about 1 micron.
Detailed Market Application Codes (VEIC)
MA Keyword
Semiconductor materials (e.g. silicon wafers);Speciality metals (including processes for working with metals);Machine tools, other metal working equipment (excl. numeric control);Other Industrial Products (not elsewhere classified)
MA Keyword Codes:
08001010;08001012;08003001;08005
Application Domain Description:
Collaboration Type
Comments:
Type of partner:
Industry or research
Field of activity of desired partner:
Planarization, chemical mechanical polishing, fly cutting or lapping expertise and technology.
Role of the partner:
Bringing in the expertise and technology to reach planarity requirements.
The Dutch SME looks for a technical cooperation agreement to downsize the non-planarity (thickness variation). After development the planarization process step will be outsourced.