Basque Enterprise Europe Network

Title

Packaging and assembly services supporting the growing demand for photonics integrated circuits packaging

Reference

TONL20191127001

Last update

Mon, May, 24, 2021

Deadline

Sun, Nov, 28, 2021

Abstract

A Dutch SME is a packaging foundry for photonic integrated circuits (PIC). The SME offers packaging and assembly services for all major PIC platforms and is specialized in hybrid integration of chip-to-chip and fiber-to-chip modules in scalable production volumes. The SME is interested in commercial agreements with technical assistance to Original Equipment Manufacturers and system integrators supporting the growing demand for PIC based modules.

Description

A Dutch SME, established in 2017, is a packaging foundry for photonic integrated circuits (PICs). The SME offers packaging and assembly services for all three major photonic integrated circuit technology platforms (Silicon, Indium Phosphide and Silicon Nitride) to Original Equipment Manufacturers (OEMs) and system integrators supporting the growing demand for PICs packaging.

At this moment the worldwide industrial focus for PICs is moving to the phase of packaging. The building blocks are established and foundries for the production of PICs are focused on production. The next step in the value chain to mature further is the packaging. There are not that many packaging foundries and the costs for the packaging step of the PICs are about 80% of the costs of the PICs.

The Dutch SME is involved in all international projects and pilot lines for packaging of PICs. The SME heavily invested in a state-of-the-art packaging infrastructure supporting all major technology platforms, each having its preferred application area. The company has the ability to combine the advantages of the different platforms by assembling them together using a low loss edge emitting coupling scheme. This unleashes new opportunities for applications which are not available today by using only a single platform.

The SME is specialized in hybrid integration of chip-to-chip and fiber-to-chip modules in a single package and provides a one-stop-shop for PICs, from design to scalable volume production.
Most common application areas are among others: next fifth generation communication (5G), sensors, structural monitoring, medical diagnostics, autonomous driving and ultra-secure cryptography.

The Dutch SME is interested in commercial agreements with technical assistance with original equipment manufacturers (OEMs) and system integrators needing PICs.
The SME offers the packaging and assembly services.
Although packaging of PICs is one of the final steps in the process, the cooperation with OEMs and system integrators preferably starts already during the design phase. Equipped with extensive PIC packaging knowledge the SME wants to collaborate with the OEMs and system integrators and their chip design team in an early stage to provide feedback on the manufacturability of their ideas and support identifying risks in an early stage. The early involvement also guarantees the product is designed for manufacturing allowing for an easy scale up from prototype to volumes.

Technology Keywords

Micro and Nanotechnology related to Electronics and Microelectronics;Semiconductors;Signal Processing;Microengineering and nanoengineering;Optics

Keyword Codes:

01002001;01002012;01006009;02002016;05003002

Current Stage of Development

Intellectual Property Rights

Secret Know-how

IPR Comments:

Exploitation of RTD Results

Organisation/Company Type

Organisation/Company Size

Organisation Comments

Detailed Market Application Codes (VEIC)

MA Keyword

Semiconductors;Laser Related;Fibre Optics;Other analytical and scientific instrumentation

MA Keyword Codes:

03001001;03005;03006;03007003

Application Domain Description:

Collaboration Type

Comments:

Type of partner:
Industry

Partners:
The desired partner(s) are Original Equipment Manufacturers (OEM) or system integrators that supply PICs based modules to an application area. Examples of application areas are next fifth generation communication (5G), sensors, structural monitoring, medical diagnostics, autonomous driving and ultra-secure cryptography.

Role of the partner:
The partner is desired to bring in the PIC and packaging specifications and requirements for the application of the PIC based modules.
The Dutch SME offers the packaging and assembly services.

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